技术委员会主席

刘胜

武汉大学

赖志明	江苏长电科技股份有限公司
刘胜	武汉大学
蔡坚	清华大学
刘勇	美国仙童半导体公司
李军辉	中南大学
田艳红	哈尔滨工业大学
肖斐	复旦大学

王聪	中南大学
Tina YANG	ASTRI, HK, China

先进封装与系统集成
主席
Wenqi ZHANG	National Center for Advanced Packaging, China
Chengqiang CUI	AKM Electronics Technology (Suzhou) Company Ltd
成员
Charlie Lu	Altera
Uihyoung Lee	Samsung Electronics Co., Ltd.
Gs Kim	Kangnam University
Cheng Yang	Intel China
Lei Shan	IBM
Wei Lin	Amkor
John Xie	Altera
Hu He	Central South University
Hao Yu	Nanyang Technological University

封装材料与工艺
主席
Changqing LIU	Loughborough University, UK
成员
Liangliang Li	Tsinghua University, China
Anmin Hu	Shanghai Jiaotong University, China
Zhiheng Huang	Sun Yat-sen University
Xin-Ping Zhang	South China University of Technology
Zhong Chen	Nanyang Technological University, Singapore
Young-Bae Park	Andong National University, Republic of Korea
Fengqun Lang	National Institute of Advanced Industrial Science and Technology, Japan
Zhiquan Liu	The Institute of Metal Research, CAS, China
Paul Wang	MSl
Su Wang	Shanghai Sinyang Materials, China
Longzao Zhou	Huazhong University of Science and Technology, China

封装设计与模拟
主席
Fei QIN	Beijing University of Technology, China
Jiantao ZHENG	Qualcomm Technologies Inc., USA
成员
Hua LU	Greenwich University, UK
Yan Zhang	Shanghai University, China
Zhongping BAO	Qualcomm, USA
Bin XIE	ASTRI, China
Hongfei YAN	Intel, USA
Xiaowu ZHANG	IME, Singapore
Jack HU	Wuhan University，China
Wenchao TIAN	Xidian University, China
Xiujuan ZHAO	Philips, Netherlands
Min MIAO	Beijing Information Science and Technology University, China
Qing ZHOU	Intel, USA
An XIAO	NXP, Netherlands
Qiang WANG	Cisco Systems Inc., China
Tong AN	Beijing University of Technology, China
Fei SU	Beihang University, China
Xingchang WEI	Zhejiang University, China

互连技术
主席
Qian WANG	Tsinghua University, China
Tielin SHI	Huazhong University of Science and Technology, China
成员
Dayuan Yu	Tianshui Huatian Technology Co., Ltd.
Xin Gu	Shennan circuits Co., Ltd.
Rong Sun	Shenzhen Institutes of Advanced Technology Chinese Academy of Sciences
Bing An	Huazhong University of Science and Technology
Yinghui Wang	The University of Tokyo

封装制造技术与设备
主席
Liang TANG	CETC Beijing Electronic Equipment CO., LTD, China
Fuliang Wang	Central South University, China
成员
Zhenqiu Liu	Tokyo Electronics Pte Ltd, Japan
Jianmin Xiong	BESI, China
Haiyang Gu	45th Research Institute of CETC,China
Chang Zhou	SMEE, China
K.H. Tan	JCAP, China
Li Gong	SUSS, China

质量与可靠性
主席
Ming XUE	Infineon, Singapore
Fei XIAO	Fudan University, China
成员
Hsien-Chie Cheng	Feng Chia University
Dongji Xie	NVIDIA Corporation
Liping Zhu	TriQuint Semiconductor
Xiuzhen Lu	Shanghai University
Boyi Wu	Flextronics Manufacturing Company
Klaus Galuschki	SIEMENS
Daoguo Yang	Guilin University of Electronic Technology

微波与功率器件封装
主席
Yong LIU	Fairchild, USA
成员
Przemyslaw Jakub Gromala	Robert Bosch GmbH
Jifa Hao	Fairchild Semiconductor
Jialiang Wen	Smart Grid Research Institute
Xueru Ding	Autoliv Active Safety
Zhaoqing Chen	IBM
Shanqi Zhao	MacMic Science & Technology Co., Ltd.
Ziyang Gao	Hongkong Applied Science & Technology Research Institute
Klaus Neumaier	Fairchild Semiconductor
Lihua Liang	Zhejiang University of Technology
Jianyong Xie	Intel
Meiling Wu	National Sun Yat-Sen University

固态照明封装与集成
主席
Yan LIU	Research Institute of Tsinghua University in Shenzhen, China
Willem Van Driel	Philips Lighting, Netherlands
成员
Hai Hu	Research Institute of Tsinghua University in Shenzhen
Lianqiao Yang	Shanghai University
Haibo Fan	NXP, HongKong
Guoqiao Tao	Philips Lighting Shanghai
Liangbiao Chen	Lamar University
Cheng Qian	State Key Lab, SSL
Xiaobing Luo	Huazhong University of Science and Technology
Yong Tang	South China University of Technology
Jian Gao	Guangdong University of Technology
Yi Luo	Dalian University of Technology

新兴领域封装
主席
Jintang SHANG	Southeast University, China
Le LUO	Shanghai Institute of Microsystem and Information Technology (SIMIT), China
成员
Mark Huang	Suzhou Speed Semiconductor Technology Co.,LTD.
Zhenfeng Wang	SIMTech
Changhai Wang	Heriot-Watt University
Jim Leu	Chiao Tung University
K. Suganuma	Osaka University
Ning Zhao	Dalian University of Technology
Zhuo Li	Houston Technology Center of CNPC
Mingxiang Chen	Huazhong University of Science and Technology
Cheng Yang	Shenzhen Research Institute of Tsinghua University
Pradeep Dixit	Indian Institute of Technology Bombay

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